Telecom single-photon detector characterization

Semi-automatic cryogenic wafer prober for I-V characterisation of III-V photodetectors, especially InGaAs/InP pin-PDs, APDs, and SPADs. Wafer diameters: 76.2 mm (3 inch), 100 mm (4 inch); multi-project wafer compatibility; cryogenic cooling option, temperature range: 77 – 300 K. Laborarory setup for electrooptical characterisation of III-V photodetectors on chip level, especially InGaAs/InP pin-PDs, APDs, and SPADs, with respect to dark-current / dark-count characteristics, spectral responsivity, photon-detection efficiency, afterpulsing etc.; chip size < 10 x 10 mm²; pulsed laser wavelength: 1550 nm; cryogenic cooling option, temperature range: 77 – 300 K.
Telecom single-photon detector characterization

Key Insights & References

Value proposition

III-V quantum photodetector characterisation service, wafer and chip level, cryogenic cooling option

Bottleneck of SOTA

Wafer-level characterisation is important for short feedback loops during the development and fabrication of III-V photodetectors. The option for cryogenic cooling of the wafer or chip samples during electrooptical characterisation of the photodetector key parameters is rarely available.

Year Published

2025

Application Area

Photonics, Semiconductor, Telecommunications, Automotive, Aerospace, Defence & Security

Quantum Sensing & Imaging

Sensing/Imaging Type

Photon Detection

Device Type

Quantum Photodetectors

Operating Environment

77 - 300 K

Performance Metrics

Dynamic Range

10 mA - 10 fA dark / photo current

Sensitivity

single photons, typ. PDE ~ 25%

Resolution

> 50 ps

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